TMS320C6472 – EVM Custom Software Product Development

TMS320C64x+ DSPs are the highest-performance multicore DSP generation in the TMS320C6000™ DSP platform. TMS320C6472 device is based on the third-generation high-performance, advanced VelociTI™ VLIW architecture developed by Texas Instruments (TI). C64x+™ devices are upward code-compatible with previous devices that are part of the C6000™ DSP platform. Developed by eInfochips, the C6472 Evaluation Module (with AMC like form factor) enables developers to immediately start evaluating TMS320C6472 processor and begin building application products around it especially those demanding high-performance computation like video & telecom infrastructures, medical and imaging.

TMDSEVM6472

The TMDSEVM6472 comes with on board XDS100 emulation capability. An external emulator via TI-60 pin JTAG emulation header can also be used.

TMDSEVM6472LE

The TMDSEVM6472LE comes with integrated XDS560v2 emulation capability. This emulator is mounted on the TI 60-pin JTAG header in the form of a Mezzanine card.

Versions

The EVM board hardware and software versions can be identified as follows

PCA REV

 PCB REV

 SW REV

Description

Hardware

Software

18-00065-02

17-00065-02

SW Rev2.0

Production build:Released in October-2009

  • Modified TSIP connections to AMC edge connector
  • Addition of Reset control from AMC carrier

Production build:Released in SDK 1.1

  • NAND flashed with COFF file of Out-Of-Box Demo
  • NAND boot loader with COFF loader implementation
  • POST

18-00065-04

17-00065-04

SW Rev 3.0

Production build:Released in March-2010

  • Differential AMC Telecom clock input supported

Production build:Released in SDK 3.0

  • POST updated for EMAC boot implementation

18-00065-05

17-00065-05

SW Rev 4.0

Production build:Released in July-2010

  • Support for XDS560v2 Emulator
  • MMC for PICMG® uTCA IPMI

Production build:Released in SDK 4.0

  • POST updated for EMAC boot in both stand-alone mode and when inserted in uTCA chassis for both LE and BE configuration.

18-00065-06

17-00065-06

SW Rev 5.0

Production build:Released in December-2010

  • NAND access through GPIO only, removed NFC from FPGA.

Production build:Released in MCSK v1.0

  • Updated the POST to give board info on console.

PCA – Printed Circuit Assembly; PCB – Printed Circuit Board

Resources – TI C6472 EVM Support

This page contains the latest support documentation and software components for the C6472 EVM. For C6472 EVM support related questions, please send us an email at evm6472support@einfochips.com

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