EIC-i.MX93-210 Multimedia Kit
EIC-i.MX93-210 Multimedia Kit
eInfochips offers Multimedia Kit which interfaces with eInfochips EIC-i.MX93-210 development kit for quick prototyping of multimedia solutions. This kit supports connectivity of Audio IN/OUT, 5.5” 1080 x1920p (FHD) resolution display with touch screen support, 1.0MP MIPI Camera (RPi-CAM-MIPI) developed by NXP & M.2 Key E type connector. It interfaces with EIC-i.MX93-210 development kit through High-Speed Connectors (HS1 & HS2) and Low-Speed Interface connector.
Multimedia Kit Features
- Audio Interfaces
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- 2x on board Analog Mic Input
- 2x 1W Speaker Out
- 1x 3.5mm Audio Jack
- 2x Digital PDM Mic input
-
Camera Interface
- Provides connectivity of 1.0MP CSI camera module “RPI-CAM-MIPI” designed by NXP
- 22-pin/0.5mm FPC/FFC connector interface to connect with “RPI-CAM-MIPI”
-
2 Key-E Type connector support
- Provide connectivity of M.2 Key E Type externa WLAN module
- Supports multiple interfaces SDIO, PCM, UART, USB, I2C
-
Display Interface
- Interface Type: 4 Lane MIPI DSI
- LCD Type: IPS TFT (16.7M)/ Transmissive
- Backlight Type: White LED (14*LED)
- Display Resolution: 1080 x 1920 (Maximum)
- Framerate supported: 60
- Bit Per Pixel (BPP): 24
- Pixel stream type: Packed pixel stream, RGB888 (24 bits per pixels)
- LCD-Active area – Outline dimensions (W x H): 68.04mm(W) x 120.96mm(H)
- Pixel pitch – 0.063mm x 0.063mm
- System Interface
- Display Data: 4 Lane MIPI DSI
- Touch: I2C
- Control: GPIOs
- Mezzanine to Display Board Cable: 40 pins FFC Cable
- Supply Voltages
- Display: 2.8V for VCC, 1.8V for I/O
- Touch: 3.3V for VCC, 1.8V IO
- Operating Temperature: -20°C ~50°C
Multimedia Kit Dimensions
- 85mm x 54mm