EIC-i.MX93-210 Multimedia Kit


eInfochips offers Multimedia Kit which interfaces with eInfochips EIC-i.MX93-210 development kit for quick prototyping of multimedia solutions. This kit supports connectivity of Audio IN/OUT, 5.5” 1080 x1920p (FHD) resolution display with touch screen support, 1.0MP MIPI Camera (RPi-CAM-MIPI) developed by NXP & M.2 Key E type connector. It interfaces with EIC-i.MX93-210 development kit through High-Speed Connectors (HS1 & HS2) and Low-Speed Interface connector.

Multimedia Kit Features
  • Audio Interfaces
    • 2x on board Analog Mic Input
    • 2x 1W Speaker Out
    • 1x 3.5mm Audio Jack
    • 2x Digital PDM Mic input
  • Camera Interface
    • Provides connectivity of 1.0MP CSI camera module “RPI-CAM-MIPI” designed by NXP
    • 22-pin/0.5mm FPC/FFC connector interface to connect with “RPI-CAM-MIPI”
  • 2 Key-E Type connector support
    • Provide connectivity of M.2 Key E Type externa WLAN module
    • Supports multiple interfaces SDIO, PCM, UART, USB, I2C
  • Display Interface
    • Interface Type: 4 Lane MIPI DSI
    • LCD Type: IPS TFT (16.7M)/ Transmissive
    • Backlight Type: White LED (14*LED)
    • Display Resolution: 1080 x 1920 (Maximum)
    • Framerate supported: 60
    • Bit Per Pixel (BPP): 24
    • Pixel stream type: Packed pixel stream, RGB888 (24 bits per pixels)
    • LCD-Active area – Outline dimensions (W x H): 68.04mm(W) x 120.96mm(H)
    • Pixel pitch – 0.063mm x 0.063mm
    • System Interface
      • Display Data: 4 Lane MIPI DSI
      • Touch: I2C
      • Control: GPIOs
    • Mezzanine to Display Board Cable: 40 pins FFC Cable
    • Supply Voltages
      • Display: 2.8V for VCC, 1.8V for I/O
      • Touch: 3.3V for VCC, 1.8V IO
    • Operating Temperature: -20°C ~50°C

Multimedia Kit Dimensions

  • 85mm x 54mm

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