EIC-i.MX93-210 Multimedia Kit

eInfochips offers Multimedia Kit which interfaces with eInfochips EIC-i.MX93-210 development kit for quick prototyping of multimedia solutions. This kit supports connectivity of Audio IN/OUT, 5.5” 1080 x1920p (FHD) resolution display with touch screen support, 1.0MP MIPI Camera (RPi-CAM-MIPI) developed by NXP & M.2 Key E type connector. It interfaces with EIC-i.MX93-210 development kit through High-Speed Connectors (HS1 & HS2) and Low-Speed Interface connector.

Multimedia Kit Features

Audio Interfaces
  • 2x on board Analog Mic Input
  • 8-bit RGB Parallel interface to MX93-210 development kit
  • 2x 1W Speaker Out
  • 1x 3.5mm Audio Jack
  • 2x Digital PDM Mic input
  • Camera Interface
  • Provides connectivity of 1.0MP CSI camera module “RPI-CAM-MIPI” designed by NXP
  • 22-pin/0.5mm FPC/FFC connector interface to connect with “RPI-CAM-MIPI”
  • 2 Key-E Type connector support
  • Provide connectivity of M.2 Key E Type externa WLAN module
  • Supports multiple interfaces SDIO, PCM, UART, USB, I2C
  • Display Interface
  • Interface Type: 4 Lane MIPI DSI
  • LCD Type: IPS TFT (16.7M)/ Transmissive
  • Backlight Type: White LED (14*LED)
  • Display Resolution: 1080 x 1920 (Maximum)
  • Framerate supported: 60
  • Bit Per Pixel (BPP): 24
  • Pixel stream type: Packed pixel stream, RGB888 (24 bits per pixels)
  • LCD-Active area – Outline dimensions (W x H): 68.04mm(W) x 120.96mm(H)
  • Pixel pitch – 0.063mm x 0.063mm
  • System Interface
    • Display Data: 4 Lane MIPI DSI
    • Touch: I2C
    • Control: GPIOs
  • Mezzanine to Display Board Cable: 40 pins FFC Cable
  • Supply Voltages
    • Display: 2.8V for VCC, 1.8V for I/O
    • Touch: 3.3V for VCC, 1.8V IO
  • Operating Temperature: -20°C ~50°C
  • Multimedia Kit Dimensions
  • 85mm x 54mm
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