TSMC - Design Center Alliance

eInfochips is a proud member of the Design Center Alliance (DCA) of TSMC’s Open Innovation Platform® (OIP). The TSMC OIP initiative is a comprehensive design technology infrastructure that encompasses all critical integrated circuit implementation areas, reducing design barriers and improving first-time silicon success. TSMC’s Design Center Alliance focuses on chip implementation services and system-level design solution enablement, lowering the design barrier for customers adopting TSMC technology.

eInfochips brings extensive experience, with 400+ successful tapeouts ranging from 180nm to 3nm technology nodes. We have enabled multiple niche ASICs on TSMC’s latest technologies for leading semiconductor giants. Being part of the DCA alliance will provide us early access to the latest implementation technologies, ensuring cutting-edge ASICs with optimized power, performance, and area for our clients. We will have a dedicated team of subject matter experts trained in the latest TSMC implementation techniques, giving our end customers a competitive edge.

eInfochips Services and Solutions

RTL to GDSII

Sign-off Services

Technology Node Migration

Fab Migration

Analog Layout and Validation

IP Signoff Services-static Timing Analysis (STA), Physical Verification, Power Analysis/Fixing

Success Stories

Accelerating potential every day

Ultra-low power PLL and DC-DC Converter Design

Executive Summary Headquartered in Japan, our client is a pioneering force in designing and developing

Case Study

Physical Design of Data Center ASIC

Case study – How we helped a niche data center infrastructure start-up with the Physical Design of an Innovative Data Center ASIC…

Case Study

Silicon Engineering Services

Physical Design, DFT & DFM Services

Our Work

Innovate

Transform.

Scale

Partnerships

Device Partnerships
Digital Partnerships
Quality Partnerships
Silicon Partnerships

Company

Products & IPs