The EIC-i.MX93-210 is an RDP kit based on NXP’s i.MX 93 applications processor. The processor includes the scalable Arm® Cortex®-A55 Core, which enables efficient machine learning acceleration and advanced security with an integrated EdgeLock® secure enclave to support edge computing.

This RDP enables developers to kick-start the development of creating more capable high-performance, cost-effective, and energy-efficient machine learning applications. As engineers progress in their product development journey, eInfochips can support them in accelerating time to market with its 25-plus years of ER&D experience. eInfochips’ expertise spans across hardware development, firmware, edge-AI enablement, end-to-end design and manufacturing.

The next-generation NXP i.MX 93 processor is a robust innovation that provides new use cases and opens a new gateway to a faster, more secure, powerful, and advanced edge-based system for industrial automation, smart home and intelligent appliances, smart buildings and automotive applications.

For more details on EIC-i.MX93-210, please visit our website.