EIC-DB-CAM-OVS
eInfochips offers the camera daughter board which allows you to connect different off-the-shelf third-party camera modules with EIC-QCS8250-210, EIC-QRB5165-210, EIC-QCS610-215/210, and EIC-QCS410-215/210 development kits for quick prototyping.
*Price is Excluding Camera Sensor Module
System On Module
System-on-Module (SoM) :
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Mechanical Specification
| Mechanical : 95mm x 67.37mm |
CPU
System On Module
Features:
- 4-lane each 3x CSI D-PHY connectors as per eInfochips Qualcomm-based reference design standard pinouts (can be connected to 30-pin CSI connectors).
- Supported third-party camera modules to be purchased separately and mounted directly on this daughter board:
- SONY IMX334
- Manufacturer # Framos, FSM-IMX334C-01C-V1A + FSA-FT3/A-V1A + 27629F-16MAS-CM (Max. resolution: 8.3 MP / 3840 x 2160 pixels)
- SONY IMX577
- Manufacturer # Framos, FSM-IMX577C-01C-V1B + FSA-FT1/A-V1A + 27629F-16MAS-CM (Max. resolution: 12.3 MP / 4056 x 3040 pixels)
- OmniVision OV5640 (works with OV7251 in combo-PHY configuration)
- Manufacturer # Leopard Imaging, Part # LI-OV5640-MIPI-AF V2.1 (Max. resolution: 5 MP / 2592 x 1944 pixels) – 2-lane CSI configuration supported.
- OmniVision OV7251 (works with OV5640 in combo-PHY configuration)
- Manufacturer # Leopard Imaging, Part # LI-OV7251M-FF-80 (Max. resolution: 0.3 MP / 640 x 480 pixels) – 1-lane CSI configuration supported.
- OmniVision OV13858
- Manufacturer # LITE-ON, Part # ABFD01M8 (Max. resolution: 13 MP / 4224 x 3136 pixels)
- SONY IMX334
- Supports video and snapshot modes based on image sensor module configuration.
Carrier Board
Mezzanine Board
Memory
Multimedia
Display
Connectivity
Networking
Audio
OS Support
Mechanical Specifications
Mechanical:
- 95mm x 67.37mm
Operating Environment
Electrical Specifications
Kit Details
