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Aikri QCS6490: Aikri-64X-90LS-8-LGA

The Aikri 6490 LGA System on Module (SoM) is based on Qualcomm® QCS6490 System on Chip and delivers greater performance, better graphics, and broader connectivity options. This compact SoM integrates a 64-bit Octa-Core application processor Kryo 670 CPU, Adreno GPU 643, Hexagon DSP with HVX and Hexagon Tensor Accelerator, AI Engine that features a fused AI-accelerator architecture and Spectra ISP 570L image-processing engine to provide exceptional performance at low power. The SoM supports Wi-Fi 6E and Bluetooth 5.2 and provides excellent processing capabilities of multiple UltraHD video streams with enhanced security for robust connections. The Aikri 6490 LGA SoM enables OEMs and engineers to evaluate performance of QCS6490 for their next-gen designs while minimizing design risk factors and reducing design cycle time with early time to market.

CPU

CPU Name : Qualcomm® QCS6490
CPU Type :

  • Qualcomm® Kyro™ 670, 64-bit applications processor
CPU Cores :

Octa-core:

  • Quad high-performance cores – 1x Gold+ core at 2.7GHz ; 3x Gold+ cores at 2.4GHz
  • Quad low power silver cores at 1.9GHz
DSP :

  • Compute Hexagon DSP with dual Hexagon Vector eXtensions (HVX), Hexagon Co-processor 2.0 and Tensor Accelerator

Memory

LPDDR5 : 8GB LPDDR5
Flash : 128GB UFS 3.1 (uMCP)

OS Support

OS : Qualcomm Linux (QLI)

Connectivity

USB : 1x USB-C 3.1
PCIe : 1x PCIe Gen 3 1-lane (for WCN6856); 1x PCIe Gen 3 2-lane (for NVMe but can be used for other use-cases)
Sensor Interfaces :

  • GPIO connections to sensor core DSP
Other Interfaces :

  • UARTs
  • I2Cs
  • I3C
  • SPIs
  • GPIOs

Networking

Wi-Fi : Qualcomm® Wi-Fi via WCN6856 WLAN 802.11ax (WiFi 6E)
Bluetooth : Bluetooth 5.2

Mechanical Specifications

Dimensions (L x W) : 44mm x 36.5mm x 3.2mm (542 LGA pins; 1.2mm pitch 0.7mm pad)

Audio

Audio Interfaces : PDM MIC, SLIMBUS, Sound-Wire

Operating Environment

Input voltage : 3.6V
Operating Temperature : -30 to +85°C

Display

Display Controller : Qualcomm ® Adreno™ 1075 DPU
Display Interfaces :

  • 1x MIPI-DSI 4-lane – D-PHY 1.2 at 1.5 Gbps per lane with split link support OR eDP 1.4 (DSI and eDP are mutually exclusive)
  • DisplayPort on USB-C

Multimedia

Graphic Controller : Qualcomm ® Adreno™ 643 GPU at 812 MHz with 64-bit addressing
Video Encode : 4K30 for H.264/H.265
Video Decode : 4K60 for H.264/H.265/VP9
Camera Interfaces :

  • Qualcomm Spectra™ ISP 570L
  • 5x MIPI-CSI 4-lane – D-PHY 1.2 at 2.5 Gbps per lane supported
  • Triple 14-bit image signal processing (ISP) + two lite ISP 22 + 22 + 22 MP, 64 MP/30 fps

CPU

 

CPU Name :                Qualcomm® QCS6490
CPU Type : Qualcomm® Kyro™ 670, 64-bit applications processor
CPU Cores : Octa-core:

  • Kryo Gold plus: high-performance core up to 2.7 GHz
  • Kryo Gold: three high-performance core at 2.4 GHz
  • Kryo Silver: four low-power cores at 1.9 GHz
DSP : Qualcomm® Hexagon™ DSP with Hexagon Vector eXtensions (HVX) and Hexagon tensor Accelerator

System On Module

Carrier Board

Mezzanine Board

Memory

 

LPDDR5  :                8GB LPDDR5
Flash  :                128GB UFS

Multimedia

 

Graphic Controller :                Qualcomm ® Adreno™ 643 GPU
Video Controller :                Qualcomm ® Adreno™ 633 VPU
Video Encode :                4K30 for H.264/H.265
Video Decode :                4K60 for H.264/H.265/VP9
Camera Interfaces :               
  • Qualcomm Spectra™ ISP 570L
  • 5x 4-lane CSIs (4/4/4/4/4) D-PHY 1.2 or C-PHY 1.2

Display

 

Display Controller :                Qualcomm ® Adreno™ 1075 DPU
Display Interfaces :               
  • 1x 4-lane DSI DSC1.2, D-PHY 1.2, or C-PHY 1.0
  • FHD+, 10 bit DisplayPort, eight hardware layers, improved HDR10+
  • Wide color Gamut, Qualcomm® Low-Power picture Enhancement display feature
  • Qualcomm® True Palette display feature, VESA DSC 1.2

Connectivity

 

USB :                1x USB 3.1
PCIe :                2x PCIe
Sensor Interfaces :                SPI, I2C, I3C, GPIO connections to sensor core DSP
Other Interfaces :               
  • SDIO
  • I2S
  • UART
  • I2C
  • I3C
  • SPI
  • GPIO

Networking

 

Wi-Fi :                Qualcomm® Wi-Fi via WCN6856 802.11a/b/g/n/ac/ax
Bluetooth :                Bluetooth 5.2/BLE

Audio

 

Audio Interfaces :                SWR, I2S, SLIMBUS

OS Support

 

OS :                Android 13.0

Mechanical Specifications

 

Dimensions (L x W) :                65mm x 40mm

Operating Environment

 

Input voltage :                3.7V
Operating Temperature :                -25 to +65 °C

Electrical Specifications

Kit Details

Documentation

eInfochips Aikri-64X-90AS-8 SoM Technical Datasheet Download

Download Report

Download Sample Report

Download Brochure

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