K2L-EVM Custom Hardware Design

The K2L Evaluation Module (EVM) with double wide AMC form-factor enables developers to immediately start evaluating TCI6630K2L processor and begin building application around it especially those demanding high-performance computation like telecom infrastructures, wireless standards including WCDMA/HSPA/HSPA+, TD-SCDMA, GSM, TDD-LTE,FDD-LTE, and WiMAX. The EVMs include an on-board, single 66xx Keystone-II SOC with robust connectivity options that allow customers to use this double AMC form factor card in various systems. EVMs can also work as a standalone. The software accompanying the K2L EVM include the Code Composer StudioTM Integrated Development Environment version 5 (CCS v5), and the Multicore Software Development Kit (MCSDK) that includes the Board Support Package (BSP), Chip Support Library (CSL), Power On Self-Test (POST), Network Development Kit (NDK), SYSBIOS, and Out of Box (OOB) Demonstration software.

The TCI6630K2L platform, based on TI’s industry leading KeyStone II architecture, combines up to two ARM® CortexTM-A15 MPCoreTM processors with four cores of TI’s TMS320C66x high performance DSP. The TCI6630K2L platform provides 2 ARM cores each running up to 1.4 GHz and 1.2 GHz of DSP processing coupled with security and packet processing and Ethernet switching, all at lower power than multichip solutions making it optimal for embedded systems.

EVMK2LX – EVMK2L Evaluation Module
The K2L EVM comes with XDS200 onboard emulation capability. In addition, an external emulator via JTAG emulation header can be also be used.

Versions

The EVM board hardware and software versions can be identified as follows

PCA REV

 PCB REV

Description

Hardware

Software

18-00175-03

17-00175-03

Production built-Rev 1.0.3.1. Released in September-2015

  • BMC v1.1.0.6
  • FPGA v4C
  • UCD9090 v4.0
  • MCSDK v3.1.3

18-00175-03

17-00175-03

Production built-Rev 1.0.3.0. Released in December-2014 66AK2E Silicon Rev 1.0.
  • BMC v1.1.0.5
  • FPGA v4.0
  • UCD9090 v4.0
  • MCSDK v3.1.0.3

18-00175-02

17-00175-02

Beta built-Rev 1.0.2.2. Released in August-2014 66AK2E Silicon Rev 1.0.
  • BMC v1.1.0.4
  • FPGA v3.3
  • UCD9090 v4.0
  • MCSDK v3.1.0.3

 18-00175-02

 17-00175-02

 Alpha built-Rev 1.0.2.0. Released in April-2014 66AK2E Silicon Rev 1.0.

  • BMC v1.1.0.3
  • FPGA v3.2
  • UCD9090 v4.0
  • MCSDK v3.1.0.1

PCA – Printed Circuit Assembly; PCB – Printed Circuit Board
“Software files are compatible with all EVMs”

Resources – K2L EVM Support

This page contains latest support documentation and software components for the TCIEVMK2LX EVM. For TCIEVMK2LX EVM support related questions, please send us an email at tievmsupport@einfochips.com

Software files are compatible with all EVMs.

Looking for custom hardware design services of TCIEVMK2LX EVM? Need embedded software development based on TCIEVMK2LX EVM? Contact eInfochips at marketing@einfochips.com

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