Turnkey Chip Design

eInfochips delivers end-to-end turnkey ASIC and SoC design services, managing the complete silicon lifecycle from architecture and RTL development to GDSII and production enablement. We help leading semiconductor innovators accelerate time-to-market with predictable, high-quality execution.

With over 400 successful tape-outs across advanced and mature process nodes ranging from 3nm to 180nm, we bring deep expertise across diverse technology platforms.

Our engineering teams specialize in full RTL-to-GDSII implementation, including UVM-based verification, DFT and AMS integration, high-fidelity emulation, and sign-off-ready physical design. We support safety-critical development with compliance to global standards such as ISO 26262 and DO-254.

We work seamlessly across leading foundry and EDA ecosystems, including TSMC, Synopsys, and Cadence, ensuring robust, sign-off-ready silicon delivery.

Our fully integrated execution model helps customers reduce NRE costs, improve yield outcomes, and accelerate deployment of AI, automotive, industrial, and edge devices backed by proven methodologies and advanced silicon engineering expertise.

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eInfochips Turnkey Chip Design Services

Architecture & Frontend Design

  • Specification definition, micro-architecture design, and RTL development
  • IP selection, integration, and reuse planning
  • Power-aware and clock-domain architecture (UPF/CPF)
  • RTL synthesis, lint, CDC/RDC analysis, and timing optimization
  • Experience across digital signal processors, controllers, and AI accelerators

Design Verification (DV)

  • SystemVerilog UVM-based environment creation and reuse
  • Constrained random, directed, and coverage-driven testing
  • Assertion-based and formal verification for complex SoCs
  • Functional coverage closure and regression automation (Jenkins/Bamboo)
  • Verification IPs for PCIe, Ethernet, DDR, USB, and custom interfaces

Physical Design (PD) & Design for Test (DFT)

  • Floor planning, placement & routing, CTS, STA, power & IR/EM analysis
  • Multi-corner multi-mode (MCMM) optimization and sign-off flows
  • DFT planning, scan insertion, ATPG, MBIST, and boundary-scan
  • High-density, low-power, and high-performance closure at advanced nodes (5 nm/3 nm)
  • Sign-off automation using Synopsys IC-Compiler II, PrimeTime, and Cadence Innovus

Analog & Mixed-Signal (AMS) Design

  • Custom analog IP design: PLL, ADC/DAC, LDO, CDR, AFE, sensor interfaces
  • Behavioral and SPICE modeling, schematic-layout co-design in Virtuoso
  • AMS simulation, verification, and top-level integration
  • Migration across technology nodes (130 nm → 28 nm → 7 nm)
  • Expertise in power management, sensor front-ends, and SerDes

Emulation & Post-Silicon Validation

  • FPGA prototyping, virtual platform (SystemC/TLM) modeling, and SoC bring-up
  • OS and firmware validation on Palladium, Zebu, and HAPS platforms
  • Board-level testing, power-on verification, and PVT characterization
  • Automation frameworks for reliability, stress, and regression testing
  • ATE program development, interface validation, and yield analysis

Packaging, Manufacturing & Lifecycle Support

  • Package co-design
  • OSAT engagement for assembly, reliability, and qualification
  • Arrow + SiliconExpert integration for BOM risk analysis and continuity
  • Production ramp-up support, EOL redesign, and sustenance engineering

End-to-End Silicon-to-System Turnkey Infrastructure

At eInfochips, we enable end-to-end turnkey ASIC and SoC programs through secure infrastructure, standardized engineering environments, advanced validation labs, and integrated supply-chain intelligence. Our infrastructure is built to ensure predictable tape-outs, IP protection, accelerated execution, and long-term production continuity.

Dedicated ODC Setups for Turnkey Programs

  • ISO 27001–certified, access-controlled engineering floors
  • Secure VPN, segregated compute, per-project license pools
  • Onsite + offshore hybrid teams for high-effort ASIC programs

Lab & Validation
Infrastructure

  • FPGA prototyping labs (HAPS, Zebu, client-provided emulators)
  • Silicon bring-up stations with oscilloscopes, logic analyzers, power analyzers
  • Environmental chambers for thermal/voltage stress testing
  • Automated test benches for firmware + interface validation
  • Device validation across networking, automotive, consumer, and IoT domains

Standardized, Automated Silicon Engineering Stack

  • Integrated RTL-to-GDSII flows across industry-leading EDA ecosystems
  • CI/CD-driven regressions, reusable UVM/DFT/AMS frameworks
  • Golden sign-off checklists for RTL, PD, STA, DFT, and LVS/DRC
  • Internal accelerators: PerfMon, AMSify, Scoreboardnetic, DFT-Cert

Arrow + SiliconExpert
Integration

  • BOM risk forecasting and end-of-life (EOL) prediction
  • Supply-chain continuity planning and lifecycle visibility
  • Packaging & final test coordination through 10+ specialist OSAT partners
  • Strong ecosystem access to 60+ VIP vendors and 50+ IP vendors for accelerated integration
  • Partnerships with contract manufacturers and EMS providers for complete system build and high-volume production
  • Material sourcing and long-term sustainment support

Accelerators and IPs

Performance Analysis Monitor
(PerfMon / PAM)

Verification IPs (VIPs)

Ethernet Verification IP

Scoreboardnetic
(Verification Scoreboard)

AMSify

Memory Model
Generator

OptiX – Physical Design
Framework

Physical Design
Framework

DFT Automated Execution &
Reporting Tool (DAeRT)

DFT Utility

ConForum for DFT Framework

Ecosystem of Partnerships

Our collaborations with industry leaders enable cutting-edge silicon innovation, ensuring robust turnkey execution and accelerated chip development cycles.

Foundry

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EDA & Tools

Devices & Platforms

NVIDIA_logo
NXP
Microchip-Logo
STMicroelectronics-Logo
Analog_Devices_Logo

Insights

Turnkey RTL-to-GDSII + Silicon Bring-up for Motion Sensor SoC

ASIC for Automotive Zone Controller

Turnkey RTL-to-GDSII Execution for High-Performance Networking ASICs

Why eInfochips for Turnkey Chip design?

End-to-End Ownership

Architecture, RTL, Verification, PD, DFT, AMS, Validation, and Packaging.

Legacy Redesign & Migration

Consolidate multiple devices into cost-optimized single-chip derivatives.

Compliance-Ready Execution

ISO 26262, DO-254, AS9100D, and IEC 61508 aligned design processes.

3

First-Time-Right Silicon

Proven frameworks and automation ensuring faster closure and reduced re-spins.

Supply Chain Continuity

Arrow Electronics ecosystem for BOM risk mitigation and lifecycle support.

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