eInfochips 855: EIC-Q855-210
The eInfochips 855 hardware development kit (HDK) is based on Qualcomm® Snapdragon™ 855 processor that offers next generation on-device AI capabilities to make voice, camera, gaming and power management smarter, faster and more intuitive. It integrates Qualcomm® Kryo 485 application processor, Adreno™ 640 GPU, and much more.
The 855 HDK enables OEMs and engineers to evaluate performance of Snapdragon™ 855 for their next-gen products while minimizing design risk factors and reducing design cycle time with early time to market. This feature-rich Android 9 development platform is an ideal starting point for integration and innovation of connected devices including AR/VR, Infotainment, 4K cameras as well as automation solutions.
CPU
| CPU Name : Qualcomm® Snapdragon™ 8150 |
| CPU Type : Qualcomm® Kryo™ 485 |
| CPU Cores : 8 |
| CPU Clock (Max) : 2.7 GHz |
Memory
| LPDDR4 : 6GB LPDDR4X PoP memory |
| UFS : 128GB UFS 2.1 |
Display
DSI :
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Connectivity
| SD : 1 x microSD card |
| USB : 2x USB 3.0 Type A Host, 1x Type-C USB3.1 |
| UART : USB Micro B connector (for Serial Debug) |
| PCI-E : 1x mini PCIe interface |
| Sensors :
Support via Sensor Card
|
| JTAG : 1x JTAG |
| GPS : Integrated Qualcomm GNSS (GPS/GLONASS/COMPASS/GALILEI) |
| GPIO : Via 1x 60-pin B2B High Speed Expansion connector |
Networking
| Wi-Fi : 802.11a/b/g/n/ac 2.4/5GHz |
| Bluetooth : Bluetooth 5.0 + HS (backward compatible) |
Audio
Audio :
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OS Support
| Android : 9.0 |
Multimedia
| 2D/3D Graphics Acceleration : Adreno™ 640 GPU | |
Video Encode :
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| VideoDecode : Video decode up to 4K120 or 8K30 | |
Camera Interfaces :
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Mechanical Specifications
| Dimensions (W x L) : 100 mm x 85 mm |
Electrical Specifications
| Supply voltage : 12V/5A DC Main Supply (*Power supply not part of Kit content) |
| Digital I/O voltage : 1.8 V |
Environmental Specifications
| Ambient Temperature Range : -30°C to +85°C (Ambient) |
