CPU
CPU Name : Qualcomm® QCS4290 |
CPU Type : Qualcomm® Kyro™ 260, 64-bit ARM v-8.0 compliant application processor |
CPU Cores :
Octa-core
|
DSP :
|
Memory
LPDDR4 : 4GB LPDDR4x |
Flash : 64GB eMMC 5.1 |
Multimedia
Graphic Controller :
|
|
Video Encode : 1080p60 8-bit HEVC/H264 | |
VideoDecode : 1080p60 8-bit HEVC/H264 | |
Camera Interfaces :
|
Display
DSI :
|
Networking
Wi-Fi and Bluetooth :
|
Audio
Audio :
|
OS Support
OS : Android 12, Kernel 4.19 |
Mechanical Specifications
Dimensions (W x L) :
|
Operating Environment
Input voltage : Input Voltage: 3.6V Nominal |
Operating Temperature : -30 to +85° C |
Connectivity
USB : 1 x USB 3.1 |
GPIO : GPIO connections to sensor core DSP |
Other Interfaces :
|
CPU
CPU Name : | Qualcomm® QCS4290 |
CPU Type : | Qualcomm® Kyro™ 260, 64-bit ARM v-8.0 compliant application processor |
CPU Cores : | Octa-core:
|
DSP : |
|
System On Module
Carrier Board
Mezzanine Board
Memory
LPDDR4 : 4GB LPDDR4x
Flash : 64GB eMMC 5.1
Multimedia
Graphic Controller : Qualcomm® Adreno™ GPU 610 at 950 MHz with 64‑bit addressing
Video Encode : 1080p60 8-bit HEVC/H264
Video Decode : 1080p60 8-bit HEVC/H264
Camera Interfaces :
Qualcomm Spectra 340T ISP
3 x 4-lane CSIs (4/4/4 or 4/4/2/1 configuration)
D-PHY 2.5Gbps/lane
C-PHY: ~10 Gbps (3.42 Gbps/trio on three trios per port)
Display
DSI :
1 x 4-lane MIPI-DSI,
D-PHY 1.2 at 1.5 Gbps per lane, FHD+ (1080 × 2520), up to 4 hardware layers
Connectivity
USB : 1 x USB 3.1
GPIO : GPIO connections to sensor core DSP
Other Interfaces :
SDIO
I2S
UART
I2C
I3C
SPI
Networking
Wi-Fi and Bluetooth : WCN3988: WLAN 1 × 1 802.11a/b/g/n/ac and Bluetooth 5.1
Audio
Audio :
WCD9370 Audio codec
Interface support – Soundwire, I2S, SLIMbus to WCN3988 BT
OS Support
OS : Android 12, Kernel 4.19
Mechanical Specifications
Dimensions (W x L) : 58 mm x 39 mm with 4x 90-pin board to board connectors
Operating Environment
Input voltage : Input Voltage: 3.6V Nominal
Operating Temperature : -30 to +85° C
Electrical Specifications
Kit Details
eInfochips, an Arrow Electronics company, is a leading provider of digital transformation and product engineering services. eInfochips accelerates time to market for its customers with its expertise in IoT, AI/ML, security, sensors, silicon, wireless, cloud, and power. eInfochips has been recognized as a leader in Engineering R&D services by many top analysts and industry bodies, including Gartner, Zinnov, ISG, IDC, NASSCOM and others.
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