NXP i.MX93 Reference Development
Platform: EIC-i.MX93-210

The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.

Price: $549.00

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Specification

CPU Name NXP i.MX93
CPU Type Two Cortex®-A55 processors operating up to 1.7 GHz.
MEMORY
LPDDR4 1x 2GB LPDDR4x RAM
eMMC 1x 16GB eMMC 5.1
SDIO 1x SDIO 3.0 interface (mux with WLAN)
Micro-SD card 1x SD Card 3.0 interface
CONNECTIVITY
Wi-Fi • AWCM276NF – IEEE 802.11 a/b/g/n/ac, 2.4/5.0 GHz
• 2x MHF4 antenna connector
• Matter 1.0 Ready
Bluetooth • Bluetooth 5.3 compliant with Bluetooth 2.1 + Enhanced Data Rate (EDR)
USB • 1x USB2.0 with DRP
• 1x USB2.0 Host mode Only
Ethernet • 1x RGMI Interface
DISPLAY
DSI 1x 4-Lane MIPI DSI v1.2 interface
LVDS 1x 4-Lane LVDS
HDMI 1x HDMI interface (Mux)
CAMERA
CSI 2 Lane MIPI CSI-2 v1.2 interface
RGB 8-bit RGB interface (Mux)
AUDIO
CSI • 3x SAI
• 1x PDM
SENSORS
Sensors • 1x 4 channel current sensor
OTHER
Other • 1x CAN Interface
• 3x UART, 4x I2C, 2x SPI, 4x ADC,GPIOs
• 1x Reset Switch, 1x ON/OFF Switch
POWER SPECIFICATIONS
SOM SOM: 3.8V to 5.5V (Typ. 5V)
Carrier (Kit)Carrier (Kit): 10.8V to 13.2V (Typ. 12V)
MECHANICAL SPECIFICATIONS
SOM 65mm x 55mm
Carrier (Kit)85mm x 100mm
OS SUPPORT
OS Linux

* This is preliminary information and subject to change without notice

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