Smart Vending Machine Gateway Module
Executive Summary
The client is a Fortune 100 platform provider with soluitons on high performance computing. As a leader in Internet-of-Things (IoT) technology, the client plans to introduce reference designs for Intelligent Vending Machines that are secure, interactive and multimedia enabled.
As a part of this project, the client planned an intermediate gateway module that would enable connectivity with a standard PC / Laptop to control the peripherals (MDB, ccTalk, Protocol-A) of the Vending Machine. For the design based on the latest Intel ATOM processor, the solution would require electronics and software to seamlessly come together, and also control the mechanical aspects on the Vending Machine.
The solution enabled the client build the next generation Vending Machines, with a large interactive touchscreen; that is deployed by multiple Fortune 100 companies across the world.
Project Highlights
- Interactive Touchscreen
- Gesture-based Interaction
- Cashless Payment
- Connectivity to Social Media
- Cloud Integration
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Executive Summary
Client is a leading industry player in complex ASIC solutions with significant time-to-market and performance advantages in high-speed computing, networking and storage applications. There was a requirement to enable SDN (Software Defined Network) functionality within this chip. Given the size and logical complexities, the client had no option but to choose 16nm technology node.
Having delivered multiple projects for the client, eInfochips was chosen to work on its first 16nm FinFET program based on capabilities and quality checklists. TSMC’s 16nm FinFET program allows unprecedented power efficiency and form factor advantages to the chip. Given that it is designed for 24×7 operational SDN routers, it would significantly bring down the power consumption for the product, and operational expenses for end users.
The client taped-out the first (of three variants) of the 16nm chips in early 2015, which has been subsequently deployed by a Fortune 100 company.
Project Highlights
- Interactive Touchscreen
- Gesture-based Interaction
- Cashless Payment
- Connectivity to Social Media
- Cloud Integration
To download this resource
Fill in the details below
Executive Summary
Client is a leading industry player in complex ASIC solutions with significant time-to-market and performance advantages in high-speed computing, networking and storage applications. There was a requirement to enable SDN (Software Defined Network) functionality within this chip. Given the size and logical complexities, the client had no option but to choose 16nm technology node.
Having delivered multiple projects for the client, eInfochips was chosen to work on its first 16nm FinFET program based on capabilities and quality checklists. TSMC’s 16nm FinFET program allows unprecedented power efficiency and form factor advantages to the chip. Given that it is designed for 24×7 operational SDN routers, it would significantly bring down the power consumption for the product, and operational expenses for end users.
The client taped-out the first (of three variants) of the 16nm chips in early 2015, which has been subsequently deployed by a Fortune 100 company.
Project Highlights
- Interactive Touchscreen
- Gesture-based Interaction
- Cashless Payment
- Connectivity to Social Media
- Cloud Integration
To download this resource
Fill in the details below