RTL to GDSII Turnkey ASIC for MEMS Applications

Executive Summary

The client is one of the the world’s leading providers of MEMS sensor platforms which consist of patents in MEMS fabrication, motion sensing, and tracking. These products address the technology needs of smartphone and wearable device makers, smart home providers, and industrial and automotive solution companies. The client has further presence in location software services to address the demand for improved performance, accuracy, and intuitive interfaces (motion, gesture and sound-based) in end consumer applications.

Having delivered multiple successful tapeouts for the client at 180nm, eInfochips was chosen to work on their first, complete, turnkey Silicon engineering project (RTL to GDSII) for MEMS applications. The goal was to migrate existing ASIC from TSMC 90nm to SMSC 55nm for improved power efficiency and smaller form factor. Given that it is designed for hand-held and consumer electronic markets, the end product helped to significantly optimize power consumption and minimize operational expenses.

The client has taped out the first variant of its new chip in early 2016, which has been subsequently deployed for the gaming industry and healthcare application markets.

Project Highlights

    • Complete turnkey ownership
    • TSMC 90nm to SMSC 55nm migration
    • MEMS ASIC with analog & digital
    • On-chip ARM M0 core
    • Targeted for gaming & healthcare
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