Physical Design of Switch Chip to Support 90+Tbps Throughput in Data Centers

Executive Summary

The client is a multinational networking company known for its versatile range of high-speed switches, routers, security and storage products. They wanted to enable multi–terabyte throughput in next-generation switch chips to address the high performance and operational (24×7 availability) needs of data centers and enterprise networking routers. Moreover, there were significant challenges to be resolved in power, area and timing.

Considering its earlier experience in other projects, the client engaged eInfochips as a technology partner for its first 28nm CMOS program to enable physical design implementation. eInfochips design implementation expertise helped them successfully tape out the first 28nm ASIC for the high-end switch in early 2015, which was consequently implemented for one of their Fortune 100 end customers.

Project Highlights

    • 28nm node for TSMC tape-out
    • 90+Tbps switch throughput
    • 400 GbE support
    • 26mm X 26mm die size
    • 1 GHz operating frequency
    • HMC support
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