The client is a Swiss-based robotics and vision AI division of a leading European conglomerate in automation and electrification. They engaged with eInfochips to develop a custom carrier board solution for real-time surround monitoring and obstacle detection. They also wanted to design a modular camera module that could be mounted on mobile platforms—such as robots and forklifts—to enable real-time SLAM-based navigation. The requirement was to develop a scalable design to support up to ten cameras. 

eInfochips delivered complete hardware and system engineering. The overall scope included schematic and PCB layout design for the carrier board, camera FPGA, camera serializer board, and sensor boards. Our team performed detailed architecture, power budget analysis, signal integrity simulation, and electro-mechanical verification. Additionally, we executed prototype bring-ups, functional validation, and EDVT. The solution also included Power over Coax (POC) network modification and simulation to optimize V3Link synchronization and enhance overall camera performance. 

Throughout this engagement, eInfochips delivered a high-performance and production-ready carrier board. This improved the camera synchronization margin by approximately 86% and enhanced real-time obstacle detection and SLAM accuracy. The project achieved significant time savings by reducing the overall development cycle by nearly four months. The final platform enabled smooth deployment across multiple robotic and industrial vehicle platforms.