Executive Summary
Powering the Future of Chiplet Interconnections
The pivot to chiplet-based architecture is transforming the semiconductor world. UCIe (Universal Chiplet Interconnect Express) has become an essential standard for facilitating reliable, high-speed inter-die communication. However, developing a SerDes IP that meets these demands at the leading-edge nodes requires deep expertise in analog mixed-signal design, verification, and system-level validation.
This is where the eInfochips edge helps. eInfochips partnered with a global semiconductor leader to deliver a production-ready SerDes IP for UCIe which was designed to support the next-generation performance and scalability across advanced process technologies, including 5nm and 18A.Shape
Download the Full Case Study
Discover the strategy, implementation, and results in this engagement, and how eInfochips helps semiconductor pioneers deliver UCIe-ready SerDes IP to market quicker and with less risk.
Read Further to Discover:
- The need to build a SerDes IP that supports UCIe adoption.
- Design complications encountered at advanced nodes.
- How eInfochips provided end-to-end support, from design to validation.
- The measurable outcomes that contributed to faster product readiness.
