High-Speed PCB Design- Layer Stack-Up, Material Selection, and Via Types

Executive Summary

Nowadays, consumer, IoT, medical and automotive products are very compact with a High-Speed interface and data-rates in GB/s. i.e. LPDDR5, MIPI-CSI, MIPI-DSI, USB3.0 etc. The High-Speed interface demands the use of a high-end PCB Manufacturing Technology. As per the increasing trend of the High-Speed interfaces requirement, the PCB material used in the design requires better efficiency to improve the digital interface performance. The PCB material and layer stack-up play a very important role while designing a board and during the actual validation of the IoT/consumer Product.

This paper describes practical guidelines for High-Speed embedded hardware designers to enhance technical skills further on top of Engineer’s basics knowledge of Electronics, PCB design & manufacturing. It helps to answer several decisions making questions during the design phase regarding PCB material type, layout complexity & prediction of challenges, which can impact the product pricing and time-to-market of the product.

Project Highlights

semiconductor
    •  Important terminologies for PCB material and how to select PCB Dielectric/core Material?
    • How to select the Layer stack-up for high speed interface application?
    • How vias are important (HDI/TH PCBs – Cost)?
To Download This Resource
Fill in the details below

Download Sample Report

Download Brochure

Start a conversation today

Schedule a 30-minute consultation with our Automotive Solution Experts

Start a conversation today

Schedule a 30-minute consultation with our Battery Management Solutions Expert

Start a conversation today

Schedule a 30-minute consultation with our Industrial & Energy Solutions Experts

Start a conversation today

Schedule a 30-minute consultation with our Automotive Industry Experts

Start a conversation today

Schedule a 30-minute consultation with our experts

Please Fill Below Details and Get Sample Report

Reference Designs

Our Work

Innovate

Transform.

Scale

Partnerships

Device Partnerships
Digital Partnerships
Quality Partnerships
Silicon Partnerships

Company

Products & IPs

Privacy Policy

Our website places cookies on your device to improve your experience and to improve our site. Read more about the cookies we use and how to disable them. Cookies and tracking technologies may be used for marketing purposes.

By clicking “Accept”, you are consenting to placement of cookies on your device and to our use of tracking technologies. Click “Read More” below for more information and instructions on how to disable cookies and tracking technologies. While acceptance of cookies and tracking technologies is voluntary, disabling them may result in the website not working properly, and certain advertisements may be less relevant to you.
We respect your privacy. Read our privacy policy.