Executive Summary
Today’s electronic devices are power-hungry and occupy smaller spaces, making it harder for PCBs to stay cool and maintain steady power levels during operation. Excessive heat not only reduces component lifespan but also increases resistance in copper traces and power planes, resulting in higher voltage drops (IR drops) under load conditions.
In the past, designers would run thermal and DC IR-drop simulations separately. While this provided useful information, it often missed the real-world impact. By combining both analyses in a co-simulation, designers gain a clearer picture of how the board actually behaves and can make better design choices from the start.
In this white paper, the author explains what thermal and DC IR-drop co-simulation is, why it matters, which factors influence it, and how to use tools like HyperLynx to implement it. Download this white paper to explore real examples and practical tips.
This whitepaper explores the following key areas:
- Thermal and IR drops are strongly interdependent
- Co-simulation reveals true voltage drops and hotspots
- Trace width, copper, vias, and layout impact performance
- Iterative simulation improves accuracy of thermal and electrical results
- Efficient components, thermal vias, and heatsinks enhance reliability
