eInfochips 2025: A Year of
Engineering Excellence & Innovation

From silicon to cloud, from mobility to healthcare, discover how
we accelerated innovation, built stronger partnerships, and delivered impact across industries.

This digital flipbook captures a transformative year marked by breakthrough engineering, award-winning platforms, global recognitions, strategic partnerships, and meaningful community impact.

Throughout 2025, we strengthened our position as a trusted engineering partner by delivering next-generation solutions in Automotive, Industrial, Healthcare, Semiconductor, Cybersecurity, and Digital Engineering. Our teams pushed boundaries to help clients bring smarter, safer, and more connected products to life.

What's Inside the Yearbook

Automotive Engineering Innovations

Automotive Engineering Innovations

From EV platforms to ADAS and cockpit systems, we advanced the future of mobility.

Highlights include:

    • Automotive Safety CXO Handbook
    • Recognition as a Rising Star in ISG Provider Lens™
    • Integration & testing of Panasonic SkipGen™ IVI platform
    • High-voltage DC-DC converter development
    • LEV traction inverter reference design
Healthcare & MedTech Innovations

Healthcare & MedTech Innovations

  • Driving smarter diagnostics, connected care, and AI-driven healthcare.
  • Launch of Conxero Health digital healthcare accelerator
  • AI-driven medical imaging advancements
  • Application briefs across telehealth, ultrasound, glucose monitoring, and more
Industry 4.0 & IIoT Transformations

Industry 4.0 & IIoT Transformations

Accelerating industrial modernization through intelligent engineering.
  • EIC PROPEL™ wins Industrial IoT Product of the Year 2025
  • Remote device monitoring platforms reducing time-to-market
  • Robotics & Autonomous Machines CoE with partner ecosystems
  • High-power design services supporting EV, energy & grid innovations
Cybersecurity for Connected Ecosystems

Cybersecurity for Connected Ecosystems

Strengthening enterprises with robust, compliant, end-to-end security.
  • CXO Handbook on Securing Connected Products
  • IEC 62443 compliance enablement for industrial systems
  • CRA vs RED compliance whitepaper
Semiconductor, Chip Design & PCB Engineering

Semiconductor, Chip Design & PCB Engineering

Delivering next-gen silicon and hardware innovation.
  • CXO Guide to Navigating Chip-Design Complexities
  • Analog & Mixed-Signal design from concept to silicon
  • PCB design for next-gen high-speed and thermally optimized products
  • Partnerships with Samsung SAFE™, NXP, Lattice, QNX & more
Strengthening Global Partnerships

Strengthening Global Partnerships

Collaborations with leading technology providers, including:Qualcomm, NVIDIA, NXP, STMicroelectronics, Microsoft, AWS, Samsung Foundry, Lattice Semiconductor, BlackBerry QNX, and others, enabling accelerated co-engineering and faster time-to-market.
Analyst Mentions

Analyst Mentions

2025 highlighted our industry leadership with recognition from:
  • Gartner® Market Guide for Quality Engineering
  • ISG Provider Lens™ (Automotive, Aerospace & Defense, Digital Engineering)
  • Everest Group PEAK Matrix® for Quality Engineering & Industry 4.0
  • Avasant RadarView™ for Digital Engineering & IoT
  • IoT Evolution’s Industrial IoT Product of the Year Award for EIC PROPEL™
#EICforGood

#EICforGood – Our CSR Impact

Driving meaningful change across education, sustainability, innovation, and community support.
  • 1000+ Chipmates volunteered
  • 8000+ lives touched
  • 15 Chipmate-led projects across 9 India locations Empowering communities through STEM initiatives, green programs, digital enablement, and social upliftment.

eInfochips remains committed to delivering reliable, high-quality engineering solutions that create long-term value for customers and partners. We look forward to continued collaboration and sustainable growth in the years ahead.

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