8 Success Factors With Multi-core Platform – Part 2 – Some Useful Platforms

Some Useful platforms

Some of the key Semiconductor leaders are focusing on multi-core processing chips or SOCs. Chip manufacturers like Texas instruments, Marvell, AMD, Qualcomm among others are leading the way in the providing the ARM and DSP based multi-core chips. Following are three of the latest SoCs based on the TI’s Keystone devices for which eInfochips has the experience and expertise to work on product designs.

TMS320C6657

TMS320C6657 DSPs are the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The C6657 device is based on the KeyStone architecture developed by Texas Instruments (TI). The C66x+ devices are code-compatible to previous devices that are part of the C6000™ DSP platform.

Key features that make it attractive are

• Scalable DSP architecture
  • Upto two 1.25GHz C66x DSP’s
  • 32 Bit DDR3-1333 Support
  • Multicore Navigator and 2.2 Tb TeraNet Switch Fabric
  • Ethernet MAC Subsystem – One SGMII Port w/ 10/100/1000 Mbps operation
  • Integrated infrastructure interfaces like 1G Ethernet, PCIe
  • Multiple high speed SERDES interfaces
  • Wireless Accelerators

Developed by eInfochips, the C6657 Lite EVM with AMC Form-Factor enables developers to immediately start evaluating TMS320C6657 processor and begin building application around it especially those demanding high-performance computation like video & telecom infrastructures, medical and imaging.

Visit: Web Page – TMS320c6657 EVM

AM5K2E0x

The AM5K2Ex platform is based on TI’s KeyStone II architecture. AM5K2Ex comes in Dual and Quad ARM Cortex™-A15 MPCore™ versions with 4MB L2 Cache. Key features that make it attractive are

• Scalable architecture
  • Upto four 1.4GHz ARM CORTEX A15
  • One 1.4GHz C66x DSP’s
  • Multi-core shared memory controller (MSMC)
  • DDR3L 1600 Support
  • Network Coprocessors: Packet and security coprocessors
  • Layer 2 Ethernet switching
  • Energy Efficient Architecture (Higher end device is sub 9W)
  • Integrated infrastructure interfaces like 1G/10G Ethernet, PCIe and USB3
  • Multiple 1G and 10G Ethernet ports and on chip Ethernet switching plus packet and security acceleration.
  • Multiple high speed SERDES interfaces
  • Support with connectivity to FPGA’s using Hyperlink (4 lanes at 12.5GBaud/Lane).
  • Rich Peripherals like PCI Express Gen2-up to 10 Gbps, USB3.0 etc

Owing to above features, AM5K2Ex is ideally suited for high performance requirements in applications like cloud infrastructure, networking control plane, routers, switches, wireless transport, wireless core network, RADAR, industrial imaging, industrial sensor networks

eInfochips has been a Platinum partner for Texas Instruments designing the evaluation Kits (EVM) for various TI’s ARM and DSP platforms. eInfochips is a services company with key focus on designing products with variety of applications.

TCI6630K2L

The K2L platform is Industry’s one of the best chip in the high performance computing and Telecom and wireless infrastructure applications. The SoC is one of the most powerful and BOM optimized solution which includes integrated digital radio front end (DRFE) suitable for ultra-high performance requirements esp small cell base station platform supporting wireless standards including OBSAI RP3 and CPRI Standards for 3G / 4G (WCDMA,HSPA, HSPA+ TD-SCDMA, LTE LTE-A, TDD, LTE FDD, TD-SCDMA, and WiMAX). Key features that make it attractive are

• Scalable architecture
• Upto two 1.2GHz ARM CORTEX A15MPCore™
• Upto four 1.2GHz C66x DSP’s
• Multi-core shared memory controller (MSMC)
• Low power – meets power over Ethernet Plus (PoE+)
• Industry’s first wireless SoC to Integrated digital radio technology DRFE (CFR:Crest Factor Reduction, DPD: Digital Pre-Distortion), allows for more efficient and cost-effective power amplifiers
• DDR3 1600 Support (Upto 8GByte) is more than what one would need
• Network Coprocessors: Packet and security coprocessors
• Multicore Navigator and TeraNet Switch Fabric
• Digital Radio Front End (DRFE) Subsystem: Support up to Four Lane JESD204A/B at max. 7.37 Gbps Line rate. Interface to Multiple Data Converters.
• IQNet Subsystem: Two lanes up to 9.83 Gbps, Antenna interface links (AIL), can be linked with DRFE, Operating at Up To 9.83 Gbps. Compliant with OBSAI RP3 and CPRI Standards.
• Two Lanes PCIe Gen2 – 5 Gbaud Per Lane Full Duplex
• Ethernet MAC Subsystem – Four SGMII Ports w/ 10/100/1000 Mbps Switches
• Integrated infrastructure interfaces PCIe and USB3 apart from common ones
• Rich Peripherals like USB3.0, USIM etc.

Imagine a board with multiple K2L devices and eInfochips is ready to handle the complexities involved. eInfochips has been a Platinum partner for Texas Instruments designing the evaluation Kits (EVM) for various TI’s ARM and DSP platforms. eInfochips is a services company with key focus on designing products with variety of applications.
Visit: Web Page – TCI6630K2L