A turnkey chip design program was undertaken to develop a highly integrated motion sensor SoC targeted for mobile, sports, and gaming applications. The objective was to deliver a complete ASIC solution that combined digital motion processing, power management, memory, I/O, and interruption handling within a compact and power‑efficient design.

The program involved significant challenges due to legacy RTL rework, migration of analog and mixed‑signal IP across multiple process nodes, and stringent power and timing constraints across digital and analog domains. In addition, the design required comprehensive validation across both pre‑silicon and post‑silicon phases to ensure reliable functionality and accelerated time‑to‑market. The engagement demanded a fully integrated, end‑to‑end execution approach to manage complexity while meeting aggressive delivery schedules.