The EIC- i.MX93-210 is a reference development platform (RDP) based on i.MX 93 application processors. The processor includes scalable Arm® cortex-A55 Core that enables efficient machine learning acceleration and advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to kick-start development of high performance, cost-effective, and energy-efficient machine learning applications. The 96-board formfactor is pin compatible with i.MX931, 932, 933, and 935 processors. It has Wi-Fi, Bluetooth, Gigabit Ethernet, Zigbee, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card. The kit includes pre-integrated Linux and Azure, making it an excellent choice for Industrial Automation, Smart Home & Intelligent Appliances, Smart Buildings, and Automotive applications.
CPU Name | NXP i.MX93 |
CPU Type | 1-2x Arm® Cortex®-A55 @ 1.7 GHz |
CPU Cores | 2 |
MEMORY | |
LPDDR4 | 2 GB LPDDR4 (On SOM) |
eMMC | 16 GB eMMC (On SOM) |
Other | Micro-SD card support |
MULTIMEDIA | |
Audio | SAI (via Low-Speed connector on carrier board) |
DISPLAY | |
LVDS (Onboard) / DSI via LS connector | 18-bit RGB (LS Connector) |
HDMI | MIPI Switch + Bridge on Carrier Board |
Camera | |
CSI | 8-bit RGB (LS Connector) |
Connectivity | |
Wi-Fi | Wi-Fi 802.11 a/b/g/n/ac |
Bluetooth | Bluetooth 5.3 (AWCM276NF) |
Others | 1 x Cellular connectivity (RT96BMEZLTEA – off the shelf mezzanine)
1 x Gbit Ethernet (1/2) 1 x CAN (1) – Transceiver on carrier board 1 x USB 3.0 (1) 5 x USB 2.0 (1 on SOM, 4 on carrier board) – 4 port USB Hub on carrier |
OS SUPPORT | |
OS | Linux AzureRTOS |
MECHANICAL SPECIFICATIONS | |
Dimensions (W x L) | Need to update |
ELECTRICAL SPECIFICATIONS | |
Power | Need to Update |