NXP i.MX93 Reference Development Platform: EIC-i.MX9-210

The EIC- i.MX93-210 is an RDP based on the i.MX93 application processors. The processor features a scalable Arm Ethos™-U65 microNPU Core for efficient machine learning acceleration, as well as advanced security with an integrated EdgeLock secure enclave to support edge computing. The RDP enables developers to begin creating high-performance, cost-effective, and energy-efficient machine-learning applications. Wi-Fi, Bluetooth, Gigabit Ethernet, CAN, and 3G/4G/LTE connectivity via a Mezzanine Card are all available. The kit includes pre-integrated Linux, making it an excellent choice for applications such as industrial automation, smart home & intelligent appliances, smart buildings, and automotive.

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Specification*

CPU Name	NXP i.MX93
CPU Type	Two Cortex®-A55 processors operating up to 1.7 GHz.

MEMORY
LPDDR4	1x 2GB LPDDR4x RAM
eMMC	1x 16GB eMMC 5.1
SDIO	1x SDIO 3.0 interface (mux with WLAN)
Micro-SD card	1x SD Card 3.0 interface

CONNECTIVITY
Wi-Fi	• AWCM276NF – IEEE 802.11 a/b/g/n/ac, 2.4/5.0 GHz • 2x MHF4 antenna connector
Bluetooth	• Bluetooth 2.1 and 3.0+ Enhanced Data Rate (EDR) + BT 5.3
USB	• 2x USB2.0 with DRP (USB Host mode support only, current BSP does not have support of DRP mode)
Ethernet	• 1x RGMI Interface

DISPLAY
DSI	1x 4-Lane MIPI DSI v1.2 interface
LVDS	1x 4-Lane LVDS
HDMI	1x HDMI interface

CAMERA
CSI	2 Lane MIPI CSI-2 v1.2 interface
RGB	8-bit RGB interface (Mux)

AUDIO
CSI	• 3x SAI • 1x PDM

SENSORS
Sensors	• 1x 4 channel current sensor

OTHER
Other	• 1x CAN Interface • 3x UART, 4x I2C, 2x SPI, 4x ADC,GPIOs • 1x Reset Switch, 1x ON/OFF Switch

POWER SPECIFICATION
SOM	SOM: 3.8V to 5.5V (Typ. 5V)
Carrier (Kit)	Carrier (Kit): 10.8V to 13.2V (Typ. 12V)

MECHANICAL SPECIFICATIONS
SOM	65mm x 55mm
Carrier Board	85mm x 100mm

OS SUPPORT
OS	Linux

* This is preliminary information and subject to change without notice

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