Semiconductor chipmakers are rapidly moving to advanced node design, which demands denser nodes. Moreover, the increase in the demand for IoT and connected devices among the users compels the device manufacturers to transition to lower geometry nodes. A lower chip design like 16nm is beneficial and appropriate for small hand-held and IoT connected devices. It also provides value in terms of speed, cost, and power optimization to meet the next generation product requirements in CPU, GPU, FPGA to ASIC, networking and mobile computing applications.

What are the 5 ASIC design challenges that crop up when engineers move to 16nm lower nodes and quick tips for right time-to-market?

Foundries are jumping into the pool of new nodes at smaller die sizes, creating a variety of challenges for chipmakers.

With regards to the ongoing trend where products are outmoded quickly, here’s the infographic that provides different ways to deal with various challenges faced by Semiconductor engineers and product engineering companies to release new products with right TTM at 16nm ASIC design solutions.