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eInfochips releases OCP2.0 eVC for verification
of OCP compliant devices
eInfochips broadens it's verification offerings with new eVC that
incorporates eRM™ and is compliant to the Coverage Driven Methodology
(CDV).
Santa Clara, CA - January 19, 2004 -
eInfochips Inc., a member of the OCP-IP (Open Cores Protocol International
Partnership) today announced the availability of its OCP eVC. The
eVC can be used for functional verification of any OCP 2.0 compliant
Master and/or Slave device in IP cores, SoC designs, etc. It works
with all HDL simulators that are supported by Specman Elite®.
The eVC has independent Master and Slave architectures and can
simulate single or multiple OCP Masters and/or Slaves in a verification
environment. It can be configured for monitoring & reporting protocol
violations and provides extensive functional coverage. Configurable
error generation allows testing of error detection mechanisms under
realistic scenarios. The eVC supports verification of DUTs written
in Verilog, VHDL or SystemC and conforms to the Coverage Driven
Verification (CDV) methodology leading to minimum number of test
cases with maximum functional coverage.
"We see an increasing number of OCP compliant products that simplify
the task of OCP interconnect verification," said Ian Mackintosh,
president OCP-IP. "The eInfochips announcement of important OCP
2.0 compatible products is further illustration of OCP-IP's thriving
infrastructure and a further testament to the widespread adoption
we are seeing throughout the industry. We are pleased with the quality
work eInfochips has done in this area."
The deliverables include a fully verified OCP eVC with documentation
and a complete test suite with comprehensive sequence library. Support
includes product updates plus around-the-clock engineering support
from eInfochips for integrating the eVC with the test environment.
The eVC is available from eInfochips, get in touch with them directly
for more information.
About eInfochips Inc.
eInfochips Inc., based in Santa Clara, is a leading provider of
cutting edge ASIC design services, Embedded systems solutions and
IP cores. The capabilities extend from Specification to Silicon,
with knowledge spanning design entry, automated verification methodologies
using HVL, eVC development, SystemC & PLI, physical layout & implementation
and board design. The company's India and US design centers have
delivered SoC and Embedded solutions to a variety of customers thus
increasing their cost-effectiveness, reducing their time-to-market
and growing their market strength. A partial list of customers includes
Intel, Broadcom, TI, LSI Logic, Cisco, Sun Microsystems, Philips.
For more information, please visit www.einfochips.com
or email Jim Cantele VP Sales, eInfochips Inc. at jimc@einfochips.com
Jim Cantele
eInfochips Inc. ,
Phone # 408-496-1882
jimc@einfochips.com
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